The Computational Heterogeneous Integrated Photonics (CHIP) Lab, led by Dr. Hamed Dalir, has received $435,000 in funding from the Semiconductor Research Corporation (SRC) to enhance photonic integrated circuits (PICs) and ferroelectric-tunable transparent conductive materials for high-performance computing applications.
The project unites an interdisciplinary team which includes Dr. Elham Heidari, Dr. Chandraman Patil, and Dr. Navid Asadi, all of whom are affiliated with the Florida Semiconductor Institute and the Department of Electrical & Computer Engineering. The team aims to tackle the challenges currently faced in building the scalable, energy-efficient photonic systems of the future. The project focuses on using novel materials and technology for a system to be used as a hardware accelerator for AI and machine learning applications.
The team intends to build devices with clock speeds of 100 GHz, with the potential to surpass 200 GHz, while ensuring outstanding energy efficiency and high device density.
“This project integrates the finest aspects of materials science, device engineering, and system-level design to create next-generation photonic AI accelerators.”
Dr. Hamed Dalir
Dr. Heidari underscored the project’s innovative potential: “Our research centers on scalable system-on-chip solutions that amalgamate cutting-edge photonic circuit designs with on-chip laser technologies and parallel processing capabilities.” The hope is to transform AI, computer vision, and hardware testing by removing dependence on analog-digital conversion on conventional devices. Photonics circuitry allows computation to remain in the photonic domain, reducing the need for repetitive analog-digital conversion, thus enhancing speed and efficiency.
The project also stresses workforce development, aiming to address the critical need for trained individuals in the semiconductor sector. Dr. Asadi, deputy director of the Florida Semiconductor Institute, said, “This transcends technology; the project aims to cultivate a pipeline of skilled engineers and researchers who will enhance the U.S. semiconductor sector and reinforce national security.”
Dr. Patil emphasized the practical implications, stating, “The results of this research will improve performance efficiency, testing quality, and reliability in sectors such as transportation and computing.”
With the acquisition of state-of-the-art sputtering equipment for ITO/BTO materials, the CHIP Lab is now uniquely equipped to produce 100 GHz optical modulators in-house—a pivotal achievement for the Florida Semiconductor Institute that sets the stage for groundbreaking advancements in photonics. “This progress is further bolstered by our collaboration with a dedicated wafer-scale tapeout foundry, enabling us to seamlessly transition from research to scalable production,” said Dr. Dalir.