“SRC’s Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap: Driving a New Era of Innovation in Semiconductors and Digital Twins”
Thursday, Feb. 27 at 1:00pm
MALA 5050
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ABSTRACT
The semiconductor industry is on the brink of a new era of innovation, propelled by the convergence of microelectronics and advanced packaging technologies (MAPT). This talk explores how the Semiconductor Research Corporation (SRC) is spearheading this transformation by democratizing and accelerating innovation in research, design, and manufacturing.
Central to this initiative is the development of a digital twin platform/framework (DT backbone) that serves as the foundation for collaborative endeavors. This framework will ensure data and tool accessibility across all members while prioritizing secure management protocols. SRC is fostering an ecosystem where members can engage and exchange ideas, collaborate on project proposals, conduct privately-funded projects, access funding opportunities, and test digital twin innovations.
An integral aspect of SRC’s MAPT Roadmap is the emphasis on attracting and training a workforce equipped to harness the potential of digital twins. By integrating digital twin technologies into education and training programs, SRC ensures a pipeline of talent capable of driving innovation forward. Ultimately, SRC’s MAPT roadmap is not only about conceptualization but also about delivery. By seamlessly integrating digital twin innovations into the manufacturing value chain, SRC is paving the way for a future where semiconductor advancements are not only envisioned but also realized.
Biography
John Oakley, an innovative Science Director at SRC, spearheads transformative research endeavors in hardware security, packaging, AI hardware, and supply chain AI realized future. A catalyst for collaboration, John cultivates strategic alliances across government, industry, and academia to drive progress in these critical domains.
With over two decades of expertise in mixed-signal design and architecture, John honed his craft at renowned institutions such as Intel Corporation, Motorola, Freescale, and Fujitsu. His distinguished career boasts 14 issued patents and the development of over 55 integrated devices, many of which have achieved significant market success. Specializing in digital and mixed signal systems, he currently focuses on advancements in the transceiver and modem realms, with a particular emphasis on cellular platform control planes. John’s mastery extends to 3GPP standards, where he served as Vice Chairman of the MIPI RFFE standard working group, contributor to the MIPI RIO and TSG standards, and collaborated with multiple 3GPP RAN working groups.
John extends his commitment to cybersecurity through his role as a board member of the Florida Institute for Cybersecurity Research (FICS).