“THINK BIG! Emerging Large-Area Electronics for Large-Scale System Integration”
Monday, Jan. 27 at 1:00pm
MALA 5050
Add to Calendar
Abstract
Device miniaturization is reaching physical limits. To continue performance scaling, the next driving force will be technologies that can keep the system scaling up. To provide this, in this talk, Dr. Wu will explore an emerging technology based on low-temperature large-area electronics, to enable a heterogeneous integration platform for future large-scale microelectronic systems. Traditionally, large-area electronics have been limited by low-frequency operation down to kilo- to mega-Hertz regime. To overcome this, Wu will introduce co-design strategies across the entire stack–from fundamental materials, to devices, circuits, and all the way up to system integration—to leverage unique technology advantages and overcome its limitations. These advancements brought the technology to the giga-Hertz regime, with pathways to further extend to millimeter-wave frequencies. Wu will use RF systems as an application example to demonstrate these co-design techniques through two systems built, including a phased array and a reconfigurable antenna. Then I will briefly discuss the transformative opportunities opened by this new technology in 2.5D heterogeneous integration, 3D monolithic integration, and human-machine interfaces.
Biography
Dr. Can Wu is currently a postdoctoral researcher at Stanford University. He received his Ph.D. in Electrical and Computer Engineering from Princeton University in 2021 and his B.S. degree from the Institute of Microelectronics at Tsinghua University in 2013. He developed large-area thin-film devices, circuits, and systems for wireless sensing and human-machine interfaces. His work has been recognized with the Best Student Poster Award at 2015 Flex Conference, Best Student Paper Award at 2019 Device Research Conference, and Top-Ranked Student Paper at 2023 IEDM. He is also the recipient of the Princeton University Gordon Wu Fellowship.